Electronic materials division
Clean & fine
With the accelerated movement toward faster and more miniaturized electronics products, there is demand for environmentally friendly and state-of-the-art manufacturing processes as well. Harima' s " Clean & Fine " slogan expresses our corporate commitment to environmentally friendly & miniaturized high-performance products, Focusing on the " Clean and Fine " concept, we are able to deliver the highest value added service and new technology to our customers by responding quickly to market needs, resolving any issue through mutual collaboration and continuous efforts for innovation.
Main products
MICROSOLDER
The miniaturization of electronics devices has played a key role in the recent revolution in mobile communications. The manufacturing of modern devices such as mobile phones typically requires that electrodes less than 0.5 mm apart be securely bonded to the correct terminal' s electronic components. For example, detailed component mounting of less than 0.5-mm pitch is required in recent devices. Our MICROSOLDER products help to ensure that solder joints are formed accurately and reliably in such applications. Our " MICROSOLDER " has been tested and evaluated as performing superbly in harsh environmental conditions to ensure remarkable accuracy and reliability. This is especially important for automotive applications where high reliability is the key factor. Our solder paste for automotive application is designed for excellent joint properties and anti-corrosion performance to prevent cracking in harsh environment. Each customer has unique requirements for solder paste, and to address this issue, Harima offers custom-made solder paste to our customers based on our extensive research in the industry. As a result of supplying superior product quality and meeting market demands, MICROSOLDER has won much praise from our customers.
Harima was a pioneer in developing lead-free solder paste to address environmental concerns. As a particular milestone, in 1998 our solder paste was the world' s first lead-free product used in an MD music player.
SUPER SOLDER
With increasing communication speed and integration density, integrated circuit boards are being made with greater numbers of fine-pitch I/Os. For this sort of fine-pitch multi-pin soldering application, it is becoming difficult to supply solder to miniature joints with conventional soldering technologies. Our unique solder precoating system (trade name: SUPER SOLDER) uses a chemical reaction to supply solder to the parts that require soldering in these intricate joints. Our SUPER SOLDER technology has drawn increasing attention in the field of ultra-fine-pitch solder precoating.
Electroconductive paste
For today' s electronics products, concepts such as energy efficiency, waste reduction, and environmental friendliness are just as important as their actual performance. Electroconductive paste formed by dispersing tiny conductive particles inside thermosetting resins can be used to form circuits simply by printing them on a substrate that is allowed to dry and then attaching the electronic components to it. These pastes are drawing attention because they are simpler to use, produce less waste, and reduce costs compared with conventional manufacturing methods.
NanoPaste
A nanometer is one-thousandth of a micrometer. At this scale, objects are too small to see, even with an electron microscope. If the size of metal particles is controlled to a few tens of nanometers, then these particles can exhibit unique properties such as a reduced melting point and the ability of a highly concentrated dispersion of metal particles to act as a liquid with low viscosity.
Our NanoPaste products are metallic inks consisting of particles of silver and gold measuring a few tens of nanometers dispersed stably and at high concentrations in a solvent. NanoPaste can be applied on a substrate by an inkjet printer to form interconnect patterns, which are then sintered by heating to form printed circuits on demand. They are useful materials that can effectively respond to the growing demand for intricate low-resistance interconnections.