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New Functional Materials

We are actively developing new functional materials. For this purpose, we are pursuing research and development aimed at the creation of new products and businesses by combining the core technologies that we have so far developed. An important role is also played by the corporate functions of the technical development departments in each business division and by research and development that take place outside the scope of our core business. Based on the constantly shifting market forces and needs, our research and development targets the fields of functional resins, joining technology, emulsification technology, pine chemicals, and analysis & evaluation technology.

UV-Curable nanoparticle dispersions

In recent years, demands for high performance and multi-functional coating agents are more and more increasing. We developed nanoparticle dispersions using synthetic technologies and our dispersing technologies. Our UV-curable nanoparticle dispersions can be mixed with various materials because of their high solubility and high transparency. Our dispersions can give various functions of the nanoparticles by mixing with various materials.

Image : Dispersants for ultra-fine particles

Hydrophilic surface coating agents

We have developed hydrophilic surface coating agents that combine our coating resin technology and dispersion technology to produce organic/inorganic nanocomposite coating agents. Special functions that can be expected from hydrophilic surfaces including anti-fogging properties, contamination resistance and antistatic properties. These coating agents bond well to metals, plastics and even glass.

Image : Hydrophilic surface coating agents

Aluminum brazing materials

Aluminum brazing materials are used in the production of heat exchangers for automotive air conditioners that are more compact and have higher performance. We have developed a new concept in brazing materials by concentrating on the technology of pre-coating methods to implement low-cost aluminum brazing with higher quality.

Image : Aluminum brazing materials

Functional resins for electronic materials

In the manufacturing process of circuit formation of electronic devices, which have undergone drastic technological revolutions of recent years, various resin technologies are employed. At Harima Chemicals, Inc. we have made further progress in traditional polymer synthesis technologies, and we have researched and developed synthesis methods for resins with new functions such as photosensitivity, photo amplification, water repellency and heat resistance.

Image : Functional resins for electronic materials

Granular talc

Talc is generally blended into thermoplastic resins in order to improve their mechanical properties. Talc powder itself is a material with low bulk density. It is therefore liable to form dust that degrades the working environment and reduces the efficiency with which it can be mixed in kneading machines. We have developed a granular form of talc powder that uses rosin modified resin as a binder to form talc granules from particles of talc powder with an average particle size of 1.8 µm.

Image : Granular talc

Fluorescent dyes

We recently developed a range of new fluorescent dyes. These are revolutionary new materials with a wide Stokes shift that overcome almost all of the drawbacks of conventional Fluorescent dyes. We have already developed orange, yellow and green pigments, and we are currently working on pigments with other fluorescent wavelengths.

Image : Fluorescent dyes

NanoPaste

The Tsukuba Research Laboratory is situated in the heart of the Tsukuba Science City, and they are working on the development of advanced materials.
We are making efforts to develop revolutionary new materials and technologies by exploiting our leading-edge technology and our location in the Tsukuba Science City.

Metallic pastes for fine pattern formation: NPS series

Nanoparticles that have been protected with a dispersant are stable at room temperature and exhibit behavior very similar to liquids.

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NanoPaste and on-demand inkjet printing facilitate the growth of printed electronics.

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Ultra-fine patterns can be formed on various kinds of substrates that exactly replicate patterns made by CAD data.

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Technical reports
(1) Nobuto Terada:The Society of Chemical Engineers, Japan, 42th Annual Meeting
(2) Masayuki Ueda : Inorganic Polymer Closed Seminar 2011

Conductive pastes

Thermosetting Conductive Paste: CP Series

Silver Paste with High Thermal Conductivity

Image : Silver Paste with High Thermal Conductivity

Silver Paste NH-3000D achieves a higher level of thermal conductivity than solder through the incorporation of Silver Nanoparticles. Application of the paste facilitates superb workability and is perfect for mounting items such as LED and power transistors packages.

Image : Image of Thermal Conductivity

Copper paste for through-holes: CP-700

Copper through-holes can be formed simply by screen printing copper paste
onto a pre-drilled substrate laminated with copper foil, which is then
heat-cured. Compared with conventional plated through-holes,
this process uses simpler manufacturing facilities, costs less, and suffers
from none of the migration problems that can occur with silver through-holes.
The resulting through-holes provide stability, low resistance,
and superior printing properties.

Image : Conductive silver paste as an alternative tin plated to electrode: ST-200

Conductive silver paste as an alternative tin plated to electrode: ST-200

When tin (Sn) plated components are bonded with ordinary silver paste,
the bond strength and electrical resistance are liable to deteriorate due
to a phenomenon called galvanic corrosion, which can easily occur
at the Sn-Ag interface. As an alternative, our conductive silver paste
(ST-200) improves the water resistance of the resin, thereby effectively
preventing this galvanic corrosion and achieving reliable silver paste joins with
low resistance. This paste can be supplied by screen printing, from a dispenser,
or by transfer printing.

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Technical report
(1) Katsuhisa Ohsako: Micro Joining Research Committee, 2006

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